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Integrated Circuits (ICs)

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ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
939
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Microchip Technology
8-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V4.5mm mmLead Free
460
8-TSSOP (0.173, 4.40mm Width)
ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
176
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management Lead Free
881
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management Lead Free
700
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
ON Semiconductor
32-VFQFN Exposed Pad, CSP Thermal Management Lead Free
130
32-VFQFN Exposed Pad, CSP
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V VLead Free
244
16-SSOP (0.154, 3.90mm Width)
NXP USA Inc.
8-VFDFN Exposed Pad Thermal Management
928
8-VFDFN Exposed Pad
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.65mm mmLead Free
386
24-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management
771
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V VLead Free
661
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V8.6614mm mm
391
24-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management Lead Free
260
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3.3V VLead Free
585
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management Lead Free
682
24-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V4.9022mm mmLead Free
972
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management
916
16-SSOP (0.154, 3.90mm Width)
Melexis Technologies NV
TO-39-4 Metal Can Thermal Management
663
TO-39-4 Metal Can
NXP USA Inc.
8-WFDFN Exposed Pad Thermal Management
111
8-WFDFN Exposed Pad
IXYS Integrated Circuits Division
16-WFQFN Exposed Pad Thermal Management 3mm mm
141
16-WFQFN Exposed Pad
Microchip Technology
8-VFDFN Exposed Pad Thermal Management
717
8-VFDFN Exposed Pad
Maxim Integrated
-40°C~85°C TA 2 Channel DUAL Battery Management ICs 1.6V MAX6786 8 Pins 2 Cell Multi-Chemistry 8-WDFN Exposed Pad
213
8-WDFN Exposed Pad
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
585
SOT-23-8
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
250
SOT-23-8
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
329
SOT-23-8
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
337
SOT-23-8
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
909
SOT-23-8
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.6614mm mm
459
24-SSOP (0.154, 3.90mm Width)
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
595
SOT-23-8
Maxim Integrated
1.2/5V -40°C~85°C 2 Channel DUAL Battery Management ICs MAX6442 8 Pins Multi-Chemistry SOT-23-8
275
SOT-23-8